Technology Roadmap
Precision PCB Technology & Innovation
Technology Roadmap and Capabilities for PCB manufacturing.
Material options such as Rogers, Isola, Panasonic, AGC Hybrid – FR4/ Ceramic, PTFE, Polyimide, and more are available. From advanced materials to automation solutions, we keep up with the ever-changing manufacturing processes ensuring your competitiveness in the market.
Technology And Roadmap Chart
| Item | Description |
|---|---|
| Layer | Layer 1 - 36Layers (FR- 4, FR- 406, 370 HR)1- 2Layers (Rogers, Aluminum/ Copper Base, TEFLON) |
| Material | FR- 4, FR- 406, 370 HR; Rogers4003; Rogers4350 Aluminum and Copper base;Teflon |
| Finish Thickness | Finish Thickness Finish Thickness: 0.008" - 0.275" (0.2mm- 7mm) |
| Min Thickness |
2- layer: 0.008" (0.2mm) 4- layer: 0.016" (0.4mm) 6- layer: 0.024" (0.6mm) 8- layer: 0.032" (0.8mm) 10- layer: 0.04" (1mm) More than 10layers (0.5Xnumber of layers X0.008") |
| Surface Finishing | Lead Finishing: HASL, HASL+Gold finger Lead- free Finishing: Lead- free HASL, ENG Gold; OSP, Immersion silver |
| Special Process |
Impedance board (request as± 10%) High TG / halogen- free/ / halogen- free & High TG board |
| Max / Min Board Size |
1- 2Layers Max : 59" x 50" / Min: 0.2" x 0.2" 4- 6Layers Max : 32" x 28" / Min: 0.4" x 0.4" 8- Layers Max : 30" x 24" / Min0.4" x 0.4 |
| Inner Layers (trace width/clearance) |
0.5oz: 4/ 4mil 1oz: 5/ 5mil 2oz: 5/ 7mil 3oz: 7/ 8mil 4oz: 10/ 10mil 5oz 12/ 12mil 6oz/ 15/ 12mil *Partial 3mil line width and 4mil clearance is allowed |
| Outer Layers (trace width/clearance) |
1/ 3oz- Hoz: 4/ 4mil 1oz: 5/ 5mil 2oz: 5/ 7mil 3oz: 7/ 8mil 4oz: 10/ 10mil 5oz: 12/ 12mil 6oz: 15/ 12mil *Partial 3mil line width and 4mil clearance is allowed |
| Aspect Ratio | 1: 10 |
| Board Thickness |
8mil - 62mil 80mil 93mil 125mil |
| Min Hole Size |
6mil 8mil 9mil 12mil |
| Min Hole Ring (Inner) |
0.5oz: 5mil 1oz: 6mil 2oz: 8mil 3oz: 12mil 4oz: 15mil 5oz: 18mil 6oz: 20mil |
| Min Hole Size (Outer) |
1/ 3oz -0.5oz: 4mil 1oz: 5mil 2oz: 7mil 3oz: 10mil 4oz: 16mil 5oz: 18mil 6oz: 20mil |
| Copper Thickness |
Inner: H0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz. 6oz Outer: 1/ 3oz, 0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz |
| Standard Stack Up | 4- layer  6- layer  8- layer  10- layer  |
| Min Hole Size / Tolerance | Min Finish Hole: 6mil Hole Tolerance: ±3mil |
| Thickness of Plating Layer |
HASL: Copper Thickness: 20um -35um, Tin 5 -20um Immersion Gold: Nickel 100u" -200 u", Gold 2u" -4u" Hard Plated Gold: Nickel 100u" -200 u", Gold 4u" -8u" Golden Finger: Nickel : 100u" -200 u" Gold : 5u" -15u" Immersion Silver: 6u" -12u" OSP: Film 8u" -20u" |
| Solder Mask Color | Glossy: Green, Black, Red, Yellow, White, Purple, Blue Matt: Green, Black |
| Solder Mask Resolution |
Solder Mask Thickness: 0.2mil -1.6mil Solder Dam: Green 7mil /Other Color 8mil Solder Mask Hole Plug Diameter: 10mil -25mil |
| Silk Screen Color | White, Black |
| Profile |
Punch Tol: ±5mil, Slot Min: 32mil CNC Tol: ±5mil, Slot Min: 32mil V- CUT Tol: ±10mil, Angel: 15°, 20°, 30°, 45°, 60° Bevel Edge: ±5mil |
| Bow and Twist |
SMT ≤0.75% None SMT ≤1% |
| Accept Standard | IPC Class 2; IPC Class 3; ISO9000 |