Lead Free Surface Finishes
Lead Free Surface Finishes
Our lead-free surface finishes ensure environmentally friendly PCB manufacturing without compromising quality. With advanced technology and strict adherence to industry standards, we provide reliable solutions tailored to your specific needs.
Lead Free Surface Finishes Chart
| Item | Description |
|---|---|
| Gold Finish | May be Electrolytic Electroless, or Immersion |
| ENIG (Electroless Nickel Immersion Gold) | 2-5 micro inches. Purpose: To prevent oxidation, extend shelf life, provide a wire bonding surface, and used to provide an electrically conductive surface on PCBs. Used for solderability when the flatness of the pad is critical. |
| Hard Gold | Purpose: Used for Gold Fingers (minimum 30 micro inches), soldering (maximum 17 micro inches), to prevent oxidation and extend shelf life. |
| Soft Gold | Purpose: Used for wire bonding (Ultrasonic minimum 2 micro inches/Thermasonic minimum 12 micro inches) and to prevent oxidation and extend shelf life. |
| Immersion Silver | Use for solderability purposes (2-5 micro inches). Used for solderability when the flatness of the pad is critical. |
| Lead Free Solder | Use for solderability purposes (2-5 micro inches). Used for solderability when the flatness of the pad is not critical. |
| OSP (Organic Solderability Preservatives) | Used for solderability when the flatness of the pad is critical. |
| White Tin (Immersion Tin) | sed for solderability when the flatness of the pad is critical. |
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